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BH2223FV,BH2221FV
Technical Note
6/7
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2010.06 - Rev.B
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●Notes for use
(1) Numbers and data in entries are representative design values and are not guaranteed values of the items.
(2) Although we are confident in recommending the sample application circuits, carefully check their characteristics further
when using them.
When modifying externally attached component constants before use, determine them so that they
have sufficient margins by taking into account variations in externally attached components and the Rohm LSI, not only for
static characteristics but also including transient characteristics.
(3) Absolute maximum ratings
Operating or testing the device over the maximum specifications may damage the part itself as well as peripheral
components. Therefore, please ensure that the specifications are not exceeded.
(4) GND potential
Ensure that the GND terminal is at the lowest potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin regarding power dissipation (Pd) under actual operating
conditions.]
(6) Terminal shorts and mis-mounting
Incorrect orientation or misalignment of the IC when mounting to the PCB may damage part. Short-circuits caused by the
introduction of foreign matter between the output terminals or across the output and power supply or GND may also result
in destruction.
(7) Operation in a strong magnetic field
Operation in a strong electromagnetic field may cause malfunction.
(8) Power source voltage
Set the power source voltage so that VCC ≧ VDD.
(9) Reset Function
The power on reset circuit, which initializes internal settings, may malfunction during abrupt power ons. Therefore, set
the time constant so as to satisfy the power source rise time.
●Thermal Derating Curve
①SSOP-B20(BH2221FV)
②SSOP-B16(BH2223FV)
Fig.18
0
100
200
300
400
500
600
700
0
25
50
75
100
125
Ta [℃]
PD
[
m
W
]
Mounted on a 70x70x1.6mm FR4 glass epoxy board (copper foil area 3% or below)
①
②
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制造商:ROHM Semiconductor 功能描述: